Cyclone® IV デバイス・ハンドブック、ボリューム 2、第 2 章: リセット制御とパワーダウン

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Cyclone® IV FPGAs Support Cyclone® IV FPGAs Support Cyclone® IV FPGAs Support

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2013-05-04
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複数のリセット信号がトランシーバー・チャネルを個別に制御します。インスタンス化された各チャネルごとに個別のリセット信号、およびトランシーバー・ブロックごとに 1 つのパワーダウン信号

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Describes the cyclical redundancy check (CRC) error detection feature in user mode and how to recover from soft errors.
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This chapter provides features and details on how LEs work, how LABs contain groups of LEs, and how LABs interface with the other blocks in Cyclone® IV devices.
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Describes and provides examples about the different modes to dynamically reconfigure different portions of the transceivers without powering down any part of the device.
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Describes the memory interface pin support and the external memory interface. Cyclone® IV devices can easily interface with a broad range of external memory devices, including DDR2 SDRAM, DDR SDRAM, and QDR II SRAM.
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Describes the hierarchical clock networks and phase locked loops (PLLs). Reconfigure the PLL counter clock frequency and phase shift in real time and dynamically adjust the output clock phase shift.
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Describes the configuration and remote system upgrades using volatile SRAM cells to store configuration data.
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Cyclone® IV Device Handbook, Volume 3: Device Datasheet
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Cyclone® IV Device Handbook, Volume 2: Transceivers
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Describes information about external power supply requirements, hot socketing specifications, power-on reset (POR) requirements, and their implementation in Cyclone® IV devices.
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Describes the boundary-scan test (BST) features that support IEEE Std. 1149.1 and IEEE Std. 1149.6. The IEEE Std. 1149.6 (AC JTAG) is only supported on the high-speed serial interface (HSSI) transceivers in Cyclone® IV GX devices.
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Built on an optimized low-power process, the Cyclone® IV device family offers lowest power, high functionality with the lowest cost with 3.125 Gbps transceivers
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Describes the electrical and switching characteristics including operating conditions, power consumption, transceiver specifications, transceiver core, and periphery performance.
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Embedded memory structure consists of columns of M9K memory blocks configured to provide various memory functions, such as RAM, shift registers, ROM, and FIFO buffers.
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A combination of on chip resources and external interfaces that help increase performance, reduce system cost, and lower the power consumption of digital signal processing (DSP) systems.
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Describes the I/O and high speed I/O capabilities driven by the diversification of I/O standards in many low cost applications, and the significant increase in required I/O performance.
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This chapter discusses Cyclone® IV GX transceivers and supported protocols.
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Cyclone® IV Device Handbook, Volume 1: Device Core, I/O Interfaces, and System Integration
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